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With a simple layer of glue, the Engineering Plate is compatible with our entire filament lineup, it's the perfect go-to solution when you're not sure which plate to use.
The refreshed coating significantly improves the plate's temperature, scratch, and corrosion resistance. Built to withstand prolonged high-temperature printing and hundreds of washes and peels, its smooth, dependable surface guarantees stable adhesion every single time.

The smooth base coating can impart a smooth & flat texture to the bottom surface of the printed object, better blend in with other surfaces.

Please note that other slicer settings might need to be adjusted based on the printed model and the filament requirements
| Materials | Heatbed Temperature | Glue Stick Required? |
| PLA/PLA-CF/PLA-GF | 45~60℃ | Glue Stick/Liquid Glue |
| PETG/PETG-CF | 60~80℃ | Glue Stick/Liquid Glue |
| ABS (not for A1 mini) | 90~100℃ | Glue Stick/Liquid Glue |
| ASA (not for A1 mini) | 90~100℃ | Glue Stick/Liquid Glue |
| TPU | 35~45℃ | Glue Stick/Liquid Glue |
| PVA | 45~60℃ | Glue Stick/Liquid Glue |
| PC/PC-CF (not for A1 mini) | 90~110℃ | Glue Stick/Liquid Glue |
| PA/PA-CF/PAHT-CF (not for A1 mini) | 90~110℃ | Glue Stick/Liquid Glue |
| PET-CF (not for A1 mini) | 80~100℃ | Glue Stick/Liquid Glue |
| Material | Polyester powder + manganese steel |
| Surface Temperature Resistance | Up to 120℃ |
| Thickness | 0.5mm |
| Usable Print Size |
X1C/P1P/P1S/A1/P2S/X2D - 256*256mm |
| Packaging Size |
X1C/P1P/P1S/A1/P2S/X2D - 315*295*15mm H2D/H2S - 393mm*380mm*15mm H2C - 393mm*380mm*15mm |
| Packaging Weight |
X1C/P1P/P1S/A1/P2S/X2D - 0.50kg H2D/H2S - 0.78kg |
Ships within 48 hours · Estimated delivery Aug 11 - Aug 16
US$40
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